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Director of Engineering Operations – Silicon Photonics / Optical Transceivers

,
California, USA | $220,000 – $300,000 + equity

Our client is a well-funded, early-stage photonics startup building next-generation coherent optical interconnect technology for AI data centres. They are tackling one of the hardest problems in high-speed optical communications and have assembled a world-class founding engineering team to do it. This is a rare opportunity to join at an inflection point and own the operational engine that turns deep photonics R&D into shipped product.

The role:

As Director of Engineering Operations, you will be the execution backbone of the company, owning the cross-functional roadmap across PIC design, lab development, systems architecture, module engineering, and customer-facing programmes. You will work directly with the technical co-founders to translate architecture and PIC requirements into product milestones, keeping tapeouts, link demos, module builds, and customer pilots on track in a fast-moving, high-ambiguity environment.

This is a high-energy leadership role for someone who thrives on creating clarity from complexity and building the operational frameworks that let world-class engineers do their best work.

What you’ll own:

  • Cross-functional execution roadmap across PIC, lab, systems, firmware, packaging, and module
  • Master plan for tapeouts, link demos, customer pilot builds, and module development milestones
  • OKR tracking, risk management, dependency management, and execution frameworks
  • Lab operations and test flow prioritisation
  • Critical link demos, fibre testing, and stability testing through product development
  • Coaching and mentoring engineers on communication, documentation, and measurement readiness
  • Customer and partner technical interactions (hyperscalers, module vendors, ASIC vendors)

What you’ll need:

  • 8–15+ years in optical transceivers, silicon photonics, optical modules, or high-speed hardware
  • Deep understanding of optical link architecture, PIC-based transceivers, WDM systems, and coupling/packaging
  • Proven track record delivering complex hardware programmes or leading multi-disciplinary engineering teams
  • Experience engineering pluggable modules and/or custom module form factors
  • Hands-on familiarity with lab workflows, test planning, validation cycles, and hardware bring-up
  • Experience with silicon photonics tapeout cycles
  • Strong communication, coaching, and stakeholder management skills
  • Background in early-stage startups strongly preferred

For more information please reach out to [email protected]

Contact:
Tom Cafolla

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